Solder-down module with STMicro’s versatile STM32MP255F

29mm Square SoM offers dual ARM Cortex-A35, NPU, VPU, GPU and PCIe

The new QSMP-25 is a 29mm x 29mm QFN Style solder-down system-on-module with STMicro STM32MP255F processor. Dual ARM Cortex-A35 processors clocked at 1.5GHz are complemented by a 400MHz ARM Cortex-M33 MCU, a 1.24 TOPS NPU for AI/ML tasks, dual MIPI-CSI camera inputs and a powerful GPU as well as an HD 60fps video pipeline. The QSMP-25 module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a QFN-footprint PCB with excellent EMC, thermal and cost optimisations. The module is square, with a height of 2.6mm, and requires a single 3.3v supply. A full industrial operating temperature range of -40C to +85C is supported.QSMP2 module ST32MP255F

A wide range of interfaces is supported including dual USB 2.0 (with on-module PHYs), or one USB 2.0 + one USB 3.0, PCIe and dual Gb Ethernet. Other connectivity includes 3x UART, 3x I2C, 2x SPI, PWM, SAI and 3x CAN.

Advanced security features support security functions for IoT and industrial applications, ready for a CRA-compliant system implementation.

The QSMP-25 comes with a dedicated Yocto Scarthgap build, providing mainline Linux kernel, with full sources and toolchain supplied as well as extensive documentation.

Development kits are now in stock – simply follow the “Buy Online” link below.

pdf-iconDownload Datasheet and Pinout

ResourceQSMP-25Detail
ProcessorSTMicro STM32MP255F
CPU2x ARM Cortex-A35
Processor Clock Max (MHz)1500
GPU3DOpenGL ES 3.1
VPU1080p60H264/VP8
NPU1.35
Embedded
Microcontroller
ARM Cortex-M33400MHz clock
RAM (MB)1024LPDDR4
Persistent Storage4GBindustrial temp eMMC
UART (RS232)3up to 6 via pin-sharing
GB Ethernet2
I2C Interface3up to 5 via pin-sharing
LCD Controller1via LVDS, 1080p
Camera1MIPI-CSI 2-Lane
Audio1SAI
SD card/SDIO (4-bit)14-wire, SD Card receptacle on baseboard
USB22x 2.0 + 1x 3.0 or PCIe
PCIe15Gb/s
SPI2up to 7 via pin-sharing
CAN-FD3
GPIOup to 73
Temperature Range-40C to +85C
Dimensions29mm x 29mmdepth 2.3mm
Power Consumption~1W245mA, 3.3V @Linux prompt
Power (Sleep)80mW
QNX-
LinuxyMainline / Yocto Scarthgap

QSBASE5 devkit for socketed QS modules

The QSBASE5 Devkit accommodates socketed QS and QSX modules. It is aimed at modules with an LVDS display output, and is compatible with the 10.1″ TX00-ZV14 panel.

  • Dual 10/100 Ethernet
  • USB
  • LVDS display connector
  • MIPI CSI camera connector
  • USB type-C connector for client/power
  • Expansion connector – RasPi power/I2C/SPI/UART compatible + CAN, SDIO

For production purposes, you will require a custom baseboard for the solder-down version of your module, and we are happy to offer baseboard design and manufacture as a service.

The QSMP-25 module is available to order now.  The following configuration is available:

QSMP-2550  (QSMP2/255F/1GS/4GF/I)

You can order the QSBASE5 kit and socketed QSMP-25 module from UK stock via our online shop, using the “Buy Online” link to the right, and it should be with you in a couple of days. We look forward to providing you with knowledgeable, professional support to create your product. If you have questions, please don’t hesitate to contact us by calling Direct Insight on +44 1295 768800 9am to 5.30pm UK time, emailing info at directinsight.co.uk, or by using the “Contact Us” form below.

Contact our experienced team with your detailed questions – we’ll be happy to help.

You can quickly access volume pricing information using the following link: Get Quote

Development kits and sample/spare modules are available from stock. Buy online.

QFN-Style SoM Advantages

For larger volume applications, or where a tiny footprint is needed, Ka-Ro QFN solder-down modules fit the bill perfectly.

solder down module pinout

The standard QS module is 27mm square. The footprint-compatible 29mm QSX modules have 8 additional pins for high-speed interfaces such as USB-3 or PCIe

In addition they offer:

  • Easy to achieve EMI compliance, thanks to integral ground plane
  • Unique ground pad design ensures alignment in 3 dimensions when soldering

  • Simple PCB layout, production and inspection thanks to edge-located pads